Latest Stencil Technology from DEK Earns Advanced Packaging Award
23 July 2008
DEK announces that its latest advance stencil technology, VectorGuard Platinum, was introduced last week at Semicon West and earned an Advanced Packaging Award.
According to the company, VectorGuard Platinum draws on micro-stencil, electroformed fabrication techniques to deliver stencils capable of addressing the challenges of advanced packaging applications that require unprecedented aperture and web spacing dimensions. Enabling extremely fine geometries, VectorGuard Platinum technology meets the demands of ball grid arrays (BGAs), direct chip attach, flip chip and wafer-level applications.
