VectorGuard Platinum
• Draws on micro-stencil, electroformed fabrication techniques to meet the demands of ball grid arrays (BGAs), direct chip attach, flip chip and waferlevel applications
• Enables apertures of 20μm on 50 μm pitch, while also delivering thickness uniformity
• Low internal stress and high hardness to eliminate stencil deformation
• Control of surface roughness to ensure accuracy, uniformity, quality and tightly controlled deposits for both pastes and adhesives
DEK
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