David Koh, Sales Manager, Marketing Services, Practical Components
"Amkor’s FusionQuad represents a breakthrough in leadframe-based plastic packaging through the integration of ExposedPad QFP and MLF Technologies.” ----------------------- 
Akira Sekiguchi, Managing Director, Tamura Corporation Singapore
"TNP-EM Series N2 Reflow System incorporates a newly designed cooling unit, and newly installed recycling boxes, which provide higher recycling efficiency.” ----------------------- 
Melvin Tan, Sales Manager, Adhesive Technologies, Henkel Singapore
"NSWC100 Thermal Paste is a nonsilicone, water cleanable thermal compound to address today’s thermal transfer priorities.” ----------------------- 
Eugene Tan, Marketing Manager, Electroloy Metal
"LF-302W Lead Free Solder Wire is the first solid wire with low temperature characteristics in Asia.” ----------------------- 
Don de Angelo, VP Marketing & Sales, Heller Industries
"Mark III Series Reflow System deliver up to 40% reduction in nitrogen and electrical consumption.” ----------------------- 
Lim Boon Siong, Business Manager, Business Development, Nutek
"NTM4910XL Laser Marking Cell is specially designed to accurately mark PCBs within a production line or as a stand alone system.” ----------------------- 
Joseph Lai, Sales Executive, and Ken Teo, Sales Engineer, Hakko Products
"FX-951 Soldering Station is ESD safe by design and shows great thermal recovery and accuracy.” ----------------------- 
Douglas K Robinson, Manager Asian Operations, VJ Electronix
"Vertex Series-A is a versatile, all purpose x-ray system with a new modular design based on solid SRT engineering and offering a 20” x 24” inspection area with 100% coverage.” ----------------------- 
SM Foo, Marketing Manager, Asia Pacific, Kester Components
"LS 371 Low Silver Lead Free No Clean Solder Paste represents a breakthrough in low cost alloy technology with the combination of superior wetting behavior, shiny joints and excellent printing.” ----------------------- 
Coco Zhang, Product Manager, and Jimmy Lee, Regional Sales Director, South East Asia, BTU International
"Pyramax solder reflow ovens are designed and built to master today’s lead free processes, and the challenges of tomorrow.” ----------------------- 
Sheon Kang, Assistant Manager, SMT Global Sales & Marketing, Samsung Techwin
"SM400 Series component placer platform offers the highest part placement capability among those of the same class.” ------------------------ 
Dr Gan Hiong Yap, Research Engineer, Multi-Functional Substrate Technology, A*Star, Singapore Institute of Manufacturing Technology
"Large Area Processing Program (LAP) focuses on developing advanced substrate processing, large area patterning and multi-functional integration technologies for the realization of advanced electronics and microsystems.” | 
