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Saturday, February 11, 2012
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GLOBALTRONICS 2008

Nitrogen Reflow Soldering System

12 September 2008

TNC51-6212EM offers high heating capacity via a newly developed 12- zone circular convection system. It features improved uniformity in blow-off air temperature, leading to high precision reflow heating for larger PCBs. Superior cooling capability is achieved by 3 dedicated cooling zones: upper, lower and side cooling. A new flux collection unit significantly enhances collection efficiency.

Tamura Corporation
Booth number: K22

 
 
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