|
|
|
IBM and NEC Electronics Sign Agreement for Joint Development of Next Generation Semiconductor Process Technology
|
|
|
|
| 12 September 2008 |
|
|
|
|
IBM Corporation and NEC Electronics Corporation announced they have entered into a multi-year joint development agreement under which they will develop next generation semiconductor process technology.
Under the agreement, NEC Electronics will participate in a joint development project for the next-generation core CMOS process, at the 32nm node, and in advanced fundamental research for leading edge semiconductor technologies of the future.
NEC Electronics will be the eighth major semiconductor manufacturer represented in the IBM joint development alliance aimed to further advance performance and power improvements for next generation silicon technologies.
www.ibm.com |
|
|
|
|
