Balver Zinn Sponsors European Electronics Assembly Reliability Summit

The 2008 European and International Conference on 'Reliability in Electronic Assemblies' is to be sponsored by metals group Balver Zinn. The conference will be held at the Tallink Spa and Conference Hotel in Tallinn, Estonia, from 22nd to 24th October 2008. There will also be in depth training workshops from US reliability guru Werner Engelmaier, Dr Thomas Ahrens from Fraunhofer ISIT and SMT specialist Bob Willis.

The summit will see key industry experts will give presentations including speakers from Siemens and Thales. The supply chain will be represented with discussions from Zestron, Rohm & Haas, Atotech, Dage and Cobar. There will also be presentations on research papers by The University of Bordeaux, Fraunhofer, IMEC, TNO and SINTEF. The technical conference will be covering reliability in specific industry sectors, such as design for reliability; production and material advancements; new inspection techniques and component issues.

"It is over two years since the RoHS deadline of July 2006 changed forever the way in which electronic products are assembled and sold within international markets. However, important reliability issues with the new technologies still remain unsolved," comments Dr Jeremy Pearce, Technology Networks Manager, at Soldertec Global. "This conference aims to deliver answers to these issues by listening to international expert speakers and by giving the opportunity for delegates to network during this two day event."

www.europeanelectronicsummit.com