Kester to Participate in 2008 IMPACT/EMAP Conference
6 October 2008
Kester announces that it will present during the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP), which will be held as a joint conference in conjunction with the TPCA Show at the Taipei Nangang Exhibition Center from October 22-24, 2008.
Kester’s presentation, “Halogen free debate on solder paste: IPC classification and application,” will be given by James Wang of Kester Taiwan on October 23. The paper will focus on the current IPC J-STD-004A standard and the impact of halogen free requirements on this classification. The solderability of halogen free solder paste formulas vs. halogenated formulas also will be examined.
For more information about the IMPACT/EMAP Conference, visit www.impact-emap.org.
