Pan Pacific Microelectronics Symposium Program Announced

The SMTA announces that the program has been finalized for the 14th Annual Pan Pacific Microelectronics Symposium & Exhibit taking place February 10 to 12, 2009 in Hawaii, USA. The conference promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.

Beginning on Tuesday, the technical program will consist of sessions on Environmental Sensitivity, Market Directions and Trends, Solderability and Reliability, Logistics and Prognostics, Test and Measurement, High Frequency Challenges, and a Keynote Presentation, "Cleaning Relevance in Electronics Assembly, the Value Proposition", by Thomas M Forsythe and Michael L Bixenman, Kyzen Corporation.

Continuing on Wednesday, the technical program will feature sessions on 3D Assembly, Unusual Soldering Challenges, Assembly Strategies and Processes, Pb Free Solders and Reliability, and another Keynote Presentation, "High Tech Investing in Difficult Economic Times", by Mario Ferrario, Redifin Italy.

Concluding on Thursday, the technical program will have sessions on Second Level Assembly, Solder Processing and Rework, Device Packaging and New Materials and Deposition.

Each year the Exhibition & Symposium attracts attendees from more than 15 different countries throughout Europe, the Americas, and the Pacific Basin.

www.smta.org/panpac