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Zestron to Participate at IMPACT/EMAP Conference
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| 16 October 2008 |
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Zestron announces that it will participate in the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP). The event will be held as a joint conference during October 22nd to 24th, 2008 in Taipei, Taiwan, focusing on all aspects of microsystems, packaging, assembly, materials and PCB.
As Taiwan is one of the key markets for cleaning applications in the Semiconductor Backend industry, Zestron said it will present a paper on "True Water Based Cleaning Innovations to Replace Solvent-Based Defluxing Products”.
The paper underlines the changes in backend cleaning processes and explains the trend towards water-based processes being introduced in the semiconductor backend market to replace solvents. The study showcases recent advancements to demonstrate distinct process benefits that can be achieved by switching to water-based products. Furthermore, current and future challenges of defluxing applications will be discussed.
www.zestron.com |
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