KIC to Present Paper at European Electronics Assembly Reliability Summit

KIC announces that MB (Marybeth) Allen will present a paper at the European and International Electronics Assembly Reliability Summit in Tallinn, Estonia from October 22-24, 2008. The paper focuses on ‘Reflow Significance on Package on Package (PoP)’ and a design of experiment will be set up to understand the implications of various reflow parameters on the final PoP yield.

More than two years after the RoHS directive first came into force, the technical conference has been set up at a critical time for the electronics industry. With new assembly methods and materials raising reliability issues, the event will provide a unique opportunity to tackle this critical topic through industry discussion, technical collaboration and information sharing, KIC said.

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