Infineon Introduces Next Generation of its ULC Mobile Phone Chips to the Market

Infineon Technologies AG has announced its third Generation of ultra-low-cost (ULC) mobile phone chips. The X-GOLD110 is said to be the world’s highest integrated one-chip solution for GSM/GPRS ultra low-cost phones.

"We are very proud to successfully introduce our third Generation ULC solution”, says Weng Kuan Tan, Division President for the Wireless Solutions Division at Infineon. "We see an ever growing demand in the ultra low-cost and entry phone segment. Our solutions perfectly serve the needs of network operators and mobile phone manufacturers who are offering their services in emerging markets, where cost efficient solutions are the most important criteria to serve the mainly lower income population. With our solutions, we enable the people in these regions to participate in the economic progress of their countries by making low cost mobile communication a reality.”

The X-GOLD110 is the heart of Infineon’s mobile phone platform XMM1100 offering optimized functionalities on a small footprint 4-Layer-PCB. The new platform supports colour display, mp3 playback, FM Radio, USB charging and is prepared for Dual-Sim and camera solutions. The XMM1100 is said to help shorten internal research cycles at the phone manufacturers from more than one year to 3 to 4 month, and optimizes production cycles by reduced component count from 200 to 50.

www.infineon.com