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PRINT EDITION > JANUARY 2009
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Nepcon China moves to Shanghai World Expo venue for 2011 event

1 January 2009

Reed Exhibitions announces that in 2011, the Nepcon China Exhibition will be held at the Shanghai World Expo venue. According to the organizer, the new venue will offer exhibitors and visitors state-of-the-art infrastructure, meeting facilities, accessibility and hotel support to ensure the success of the event and secure its future growth for years to come. Reed Exhibitions entered into the agreement with the Shanghai World Expo (Group) Co Ltd, made official during a signing ceremony held on the 26th November, 2008.

According to Reed, the new venue will be finalized by 2011 and will provide China’s SMT and electronics manufacturing industry and its overseas supporters with a first-class, modern exhibition hall. Visitors to the event will have convenient access to restaurants and accommodation facilities nearby the new venue. This will enable Reed Exhibitions to continually improve the management and services at the event and to build a platform from which to provide increasing business opportunities for both domestic and overseas exhibitors and visitors, the show organizer said.

www.nepconchina.com

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