|
|
|
Siplace Invites Visitors to Compare for Real Performance at Nepcon China 2009, Shanghai
|
|
|
|
| 31 March 2009 |
|
|
|
|
Siplace announces that it is bringing more innovations to Nepcon China from 21–24 April 2009, Shanghai.
One of the highlights include the new Siplace X-Series powered by Siplace MultiStar which delivers the combination of chip shooting speed along with extensive component range capability required for flexible end of line placement.
The new Siplace head can be seen on the Siemens Booth at the Shanghai Everbright Convention & Exhibition Center.
www.siplace.com |
|
|
|
|
