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Friday, May 18, 2012
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NEWS > MAY 2009

Solarcon Singapore to be Co-Located with Semicon Singapore

8 May 2009
8 programs, 42 speakers, targeting advanced packaging and testing, cost and technology, and new market opportunities

Foreseeing the expanding market and rising interest in photovoltaic manufacturing technology, SEMI launched Solarcon Singapore which will co-located with Semicon Singapore to take place on May 20-22, 2009 at the Suntec Singapore International Convention and Exhibition Centre.

Despite the global economy recession, the good times are expected to return in 2010. Photovoltaic, in particular, is the rising star in the future. According to iSuppli, revenue growth of 57.8 percent is expected in 2011, followed by similar levels through 2013 as both demand and supply become more balanced.

”Singapore not only stands at the forefront of the world’s test, assembly, and packaging market, but also the first South East Asian hub for solar PV testing and certification,” said Paul Davis, Executive Vice President of SEMI. "Semicon and Solarcon Singapore connects the suppliers, speakers, technologies, market opportunities that can help companies manage the current economic downturn and prepare for the upswing.”

In conjunction with Semicon Singapore, Solarcon Singapore will also showcase products and technologies aimed at the growing solar/photovoltaic (PV) market in South East Asia. In addition to the exhibition, the Solar Energy/ Photovoltaic Symposium will offer an in-depth look into the market opportunities in Asia, the applications development, and the technologies and standards that can drive down the cost. The featured speakers include Charles Gay, the President of Applied Materials Solar, Andreas Balzer, the Managing Director of REC Systems Pte Ltd, and the CEO of Solar Energy Research Institute of Singapore (SERIS) as well as the Managing Director of Conergy Renewable Energy Singapore.

On the other hand, Semicon Singapore still focuses on the advanced packing and testing technologies. As 3D IC integration is becoming an important technology, a workshop conducted by Professor John H Lau will focus on the key enabling technologies for 3D IC integration and wafer-level Packaging (WLP). Besides, the SEMI Technology Symposium (STS), will examine the latest industry trends and feature presentations from leading technologies in tech field of packaging, test and wafer processing.

The Advanced Packing Technology Symposium on May 21 will focus on healthcare and communication. The keynote will be presented by Dr Sywert Brongersma, the Principal Researcher of IMEC/Holst Centre, and Tero Marjamaki, Head of Portfolio Planning of Nokia. The Wafer Processing Technology keynote featuring Jagadish CV, CEO of SSMC.

All the conferences will take place at Suntec Convention Centre.

www.semiconsingapore.org

 
 
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