Indium Corporation to Present at ECTC

Indium Corporation’s Vice President of Technology, Dr Ning-Cheng Lee, will present the paper, "Achieving High Reliability, Low Cost, Lead Free SAC Solder Joints Via Mn or Ce Doping” at the 59th Electronic Components and Technology Conference (ECTC) held in San Diego, CA, USA, May 26-29, 2009. He will also chair the professional development course, "Achieving High Reliability of Lead Free Soldering — Materials Consideration” at the conference.

Dr Lee’s paper focuses the effect of additions of manganese or cerium on the reliability (drop test and thermal cycling) of traditional and lead-free (tin/silver/copper) solder alloys. Drop tests and thermal cycling replicate harsh usage of electronics products to ensure finished goods reliability. The paper will be presented on May 29th as part of session 22: Lead Free solder.

The professional development course will explore the detailed material considerations required for achieving high reliability in lead free solder joints. Topics include: understanding factors related to various failure modes, and how to select proper solder alloys and surface finishes. The course will be presented at the morning session on May 26th.

Sponsored by the IEEE’s Components, Packaging and Manufacturing Technology Society (CPMT), and the Electronic Components Association (ECA), ECTC focuses on the electronics industry, including electronic components, materials assembly, packaging, system packaging, and optoelectronics, as well as emerging technologies.

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