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Panasonic Develops New Multi-Layer Printed Circuit Board Material
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| 11 June 2009 |
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Panasonic Electric Works Co Ltd announced that it has successfully developed a new multi-layer printed circuit board material "MEGTRON4", designed to realize large capacity/high speed signal transmission in communication network equipment such as middle range server and routers, and applied to lead free solder assembly. The company said it will release this product on June 20, 2009 worldwide simultaneously.
Panasonic plans to achieve a sales amount of MEGTRON4 of 3.6 billion yen/year by 2012, through the qualification activity for targeting middle-range networking equipment market and applying the existing sales result for MEGTRON6 to the high end networking equipment. This product will be exhibited at the JPCA Show 2009 held at Tokyo Big Sight from June 3 to June 5.
http://panasonic-denko.co.jp |
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