KIC to Host Upcoming Webinar on Profiling BGAs

KIC announces that Brian O’Leary, Sales Manager – Americas, will host a free webinar on June 26, 2009 at 1 pm PST. The topic of the webinar will focus on providing solutions to common thermal process and profiling issues.

Titled “How to Profile BGAs,” the webinar will last 30 minutes and will highlight ways of successfully profiling BGAs. BGAs are becoming ever more difficult to properly reflow due to a whole host of challenges, such as BGAs relative thermal mass to other components, their relative position to other components on denser populated boards, differences in conductive materials such as ceramics and the tightening of overall reflow specs due to lead free conversion. All of these new demands leave little room for error, thus the need for high quality profiles.

During this webinar, KIC will discuss various techniques for reliability profiling BGAs, such as thermocouple attachment. Also discussed will be some groundbreaking methods of BGA inspection, using the profiling process as one more tool in the arsenal to create a more robust inspection regiment for BGAs.

For more information, or to join the meeting on June 26, visit https://kicthermal.webex.com/kicthermal/j.php?ED=107946417&UID=85293982. The meeting number for this Webinar is 331 436 382.

www.kicthermal.com