DEK’s Ball Placement Technology Advances Toward Microsphere Capability

DEK announces that its DirEKt Ball Placement process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99 percent, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance, the company said.

DEK points out that unlike alternative methods that employ serial approaches for placement of solder balls, the parallel print process of DirEKt Ball Placement allows for repeatable accuracy and fast cycle times which are completely independent of I/O count. These statistics are consistent with requirements for next generation wafer-level CSP devices, the company added.

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