Frost & Sullivan Recognizes Amkor for Technology Innovation

Based on its recent analysis of the advanced electronic packaging market, Frost & Sullivan recognizes Amkor Technology Inc with the 2009 Global Frost & Sullivan Technology Innovation of the Year Award. Amkor's line-up of innovative new products, including through mold via package on package (TMV(TM) PoP), FusionQuad, and flip chip molded ball grid array (FCMBGA).

"FCMBGA is the advanced and improved version of Amkor's Super Flip Chip (SuperFC) high performance platform," says Frost & Sullivan Research Analyst, Karthik Kamalakannan. "This technology provides multiple benefits, including improved board space usage, by allowing closer spacing between passive components and the flip chip die resulting in smaller body size and cost savings."

"TMV PoP allows for thinner bottom packages that offer a larger die-to-package ratio, and has shown significant improvement in warpage control with up to a 30 percent increase in die-to-package size," notes Karthik. "TMV also removes the solder ball pitch versus stack height limitations seen in current PoP technologies and will allow the stacked interface to scale down to 0.3mm pitch supporting high density roadmap requirements."

Each year, Frost & Sullivan presents this award to the company (or individual) that has carried out new research, which has resulted in innovation(s) that have or are expected to bring significant contributions to the industry in terms of adoption, change, and competitive posture. This award recognizes the quality and depth of a company's research and development programs as well as the vision and risk-taking that enabled it to undertake three major new package platform launches in the past year.

Frost & Sullivan's Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.

www.amkor.com
www.frost.com