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Friday, December 5, 2008

Home

Current Issue

Adhesives/Coatings

Assembly Tools/Equipment

Cleaning Technology

Dispensing Technology

Identification Systems

Microelectronics/ Components

Optoelectronics/Storage

Packaging & Interconnect

PCB Production

Pick & Place

Programming

Rework & Repair

Software/Process Control Systems

Soldering Equipment

Soldering Materials

Stencil & Screen Printing

Supply Chain /Business

T&M/Inspection

November 2008 Issue

Highlights:

Green manufacturing – An EMS company’s perspective

The next big thing

Reflow significance on Package on Package assembly

Future lead free solder alloys and fluxes– Meeting challenges of miniaturization

View Current Issue

As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?

Yes, in the EMS space

Yes, in the ODM space

No, highly unlikely

View Results

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Flexible pick-and-place system

2 January 2006

FLX 2020-V
• For high-mix production
• Modular system features a large feeder capacity—up to 310 feeders, graphical control software, inventory control and traceability
• Can accept most kinds of feeding system
• Equipped with a combination of different alignment systems—laser and vision

Essemtec AG
www.essemtec.com

	Essemtec’s New Brochure Provides Information About LED Production and Processing

	Essemtec Premiers New Pick and Place System for 3D-MID

	Essemtec Announces Optimization of Machines for the Processing of Silicone Keys

	Quasys to Manufacture and Sell BESI/Datacon JEDEC Feeder Globally

	MYDATA Appoints New Managing Director in China

	Universal Instruments Marked a New Milestone with the Shipment of the 1000th Lightning Head

	Assembléon Adapts Its Organization to Become Structurally Profitable

	Siemens EA Announces Carve-Out Schedule; Holds Siplace Compare Convention 2008

	Essemtec Opens New Demo and Training Center in Suzhou, China

	Juki Plays A Part in the 2008 Olympics

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	Printer Friendly Version

	Email to a Friend

Sponsored Links

	Hewlett-Packard to Increase Procurements in Taiwan in 2009

	Proposed New RoHS and WEEE Directives Published

	Intel, Hitachi Agree to Develop SSDs for Business Use

	IPC Environmental Symposium to Tackle Compliance with Changing Legislation and Customer Requirements

	Indium Corporation’s Scalzo and Hwang Receive Black Belt Certifications

	Quanta to Supply Kontron with Embedded PC Systems

	Flextronics Reportedly to Cut 30 Percent Tech Jobs in China

	Gen3 Systems Appoints PCI as its New Sales Distributor in India

	Toshiba to Outsource Increased Production to Taiwanese Makers

	High-Tech Conversions Introduces Online Green Resource

View More Daily News

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EM ViewPoint

Chan Wha Pak, CEO/President, Mirtec Co Ltd, discusses the development of automated optical inspection (AOI) technologies to meet the “third dimension” in inspection capability.

Read the Full Viewpoint Article

Environmental Compliance

	Greenpeace: Consumer Electronics Companies Slow on Climate Action

	GreenSoft Technology Launches GreenData Manager-REACH

	Premier Farnell Launches Campaign to Tackle Dangers of Unregulated E-Waste Recycling in Developing Countries

Read All Environmental Articles

Market Trends

	iSuppli Trims LCD TV Forecast, But Sees Continued Growth

	Sales of Mobile Handsets in Asia Pacific Increase Despite Economic Pressure

	Taiwan to Ship 3 Percent Lesser Monitors in 2008: MIC

Read All Market Trends Articles

Business Intelligence & Strategy

	Recipe for Growing Sales in Emerging Electronics and High-Tech Markets

	Choosing the Right EMS Provider for Medical Products Outsourcing

	High-Mix, Low Volume: Primed to Buy, Sell, Merge or Acquire?

Read All Business Articles

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Flexible pick-and-place system

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