Finetech to Present at SMTAI 2009

Finetech’s Neil O’Brien will present "Fine-Pitch QFN Rework — Triple the Challenge in a Lead-Free World” at the upcoming SMTA International at The Town and Country Resort and Convention Center in San Diego, USA. The presentation will be held during session SMT4, titled "Challenges and Solutions Relating to the Rework of QFN Packages,” on Wednesday, October 7, 2009 from 8-9:30am.

Quad Flat No-Lead (QFN) packages have gained wide scale acceptance and typically appear in densely populated boards where real estate is at a premium. As with all components, size and pitch continue to narrow, leaving traditional hand rework behind. The design, size and assembly process of QFNs present unique rework challenges not seen with other components. Neil’s presentation will focus on the complete rework process, including component removal, site preparation, component paste printing, and finally new component soldering. The stencil design and paste process will be looked at in depth and soldering results evaluated. Triple row QFNs will be the test case.

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