Close
Username:
Password:

Invalid username or password!

click here

New Member Sign Up

Members
Log In

Print Subscription

Bookmark EMAsia

Friday, December 5, 2008

Home

Current Issue

Adhesives/Coatings

Assembly Tools/Equipment

Cleaning Technology

Dispensing Technology

Identification Systems

Microelectronics/ Components

Optoelectronics/Storage

Packaging & Interconnect

PCB Production

Pick & Place

Programming

Rework & Repair

Software/Process Control Systems

Soldering Equipment

Soldering Materials

Stencil & Screen Printing

Supply Chain /Business

T&M/Inspection

November 2008 Issue

Highlights:

Green manufacturing – An EMS company’s perspective

The next big thing

Reflow significance on Package on Package assembly

Future lead free solder alloys and fluxes– Meeting challenges of miniaturization

View Current Issue

As major EMS/ODM companies continue to face strategic and operational challenges, will we see another giant merger in 2008?

Yes, in the EMS space

Yes, in the ODM space

No, highly unlikely

View Results

click here

Manufacturing Products & Equipment

1 January 2006

Intelligent placement system

Flexible pick-and-place system

Four-gantry placement machine

Ultra-high-resolution inspection

Intelligent long-distance TAP connection

Multi-configuration, multi-function ATE system

Fuji compatible tape feeders

Combination cleaner

Wave solder measurement system

Universal engineering programmer

	Gen3 Systems Appoints PCI as its New Sales Distributor in India

	Saki Corporation Signs S&P Agreement to Acquire MacroScience Technology From Schmidt Electronics Group

	Essemtec’s New Brochure Provides Information About LED Production and Processing

	Covenant UltraTech to Distribute CheckSum Products in the Philippines

	Rohde & Schwarz Celebrates its 75th Anniversary

	Kyzen to Present SMTA-Sponsored Electronics Assembly Cleaning Webinar

	GreenSoft Technology Launches GreenData Manager-REACH

	Orbotech Plans to Exit PCB Assembly Equipment Business

	Essemtec Premiers New Pick and Place System for 3D-MID

	Agilent Demonstrates Range of Measurement Solutions at Electronica 2008

	Free Print Subscription

	Printer Friendly Version

	Email to a Friend

Sponsored Links

	Hewlett-Packard to Increase Procurements in Taiwan in 2009

	Proposed New RoHS and WEEE Directives Published

	Intel, Hitachi Agree to Develop SSDs for Business Use

	IPC Environmental Symposium to Tackle Compliance with Changing Legislation and Customer Requirements

	Indium Corporation’s Scalzo and Hwang Receive Black Belt Certifications

	Quanta to Supply Kontron with Embedded PC Systems

	Flextronics Reportedly to Cut 30 Percent Tech Jobs in China

	Gen3 Systems Appoints PCI as its New Sales Distributor in India

	Toshiba to Outsource Increased Production to Taiwanese Makers

	High-Tech Conversions Introduces Online Green Resource

View More Daily News

click here

EM ViewPoint

Chan Wha Pak, CEO/President, Mirtec Co Ltd, discusses the development of automated optical inspection (AOI) technologies to meet the “third dimension” in inspection capability.

Read the Full Viewpoint Article

Environmental Compliance

	Greenpeace: Consumer Electronics Companies Slow on Climate Action

	GreenSoft Technology Launches GreenData Manager-REACH

	Premier Farnell Launches Campaign to Tackle Dangers of Unregulated E-Waste Recycling in Developing Countries

Read All Environmental Articles

Market Trends

	iSuppli Trims LCD TV Forecast, But Sees Continued Growth

	Sales of Mobile Handsets in Asia Pacific Increase Despite Economic Pressure

	Taiwan to Ship 3 Percent Lesser Monitors in 2008: MIC

Read All Market Trends Articles

Business Intelligence & Strategy

	Recipe for Growing Sales in Emerging Electronics and High-Tech Markets

	Choosing the Right EMS Provider for Medical Products Outsourcing

	High-Mix, Low Volume: Primed to Buy, Sell, Merge or Acquire?

Read All Business Articles

click here

Home

Current Issue

Manufacturing Products & Equipment

Reed Business Information Asia Interactive Network