iNEMI to Hold Packaging Substrates Workshop in Japan

iNEMI annonuces that it will be sponsoring a packaging substrates workshop on November 17-18, 2009 at the Lucent Tower Conference Center in Nagoya, Japan. The purpose of this industry workshop is to identify gaps in organic substrate technology that need to be addressed to facilitate the continued miniaturization of electronics packaging. The workshop will feature speakers from OEMs, semiconductor firms, packaging firms and substrate providers.

The event will cover the following agenda:
• Review organic substrate technology roadmaps and compare vs. industry requirements – identify gaps
• Brainstorm options and priorities
• Establish action groups to address specific issues, based on outcomes of meeting
• Identify issues and needs best solved by consortial activities
• Form action groups to execute the required industrial collaborative programs

List of speakers include Mario Bolanos, TI; Hamid Azimi, Intel; Luis Rivera, TI; Jie Xue, Cisco; and Hirofumi Nakajima, NEC Electronics.

For agenda and registration, visit http://www.inemi.org/cms/calendar/Packaging_Substrates_Nov09.html

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