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600 Plus Participants Attend Teradyne’s Asia Device Test Seminars
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| 11 December 2009 |
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More than 600 participants from more than 100 companies attended the Teradyne Inc Device Test Seminar series in October and November, according to the company. The latest device technologies and test strategies along with Teradyne’s solutions that address these test challenges were presented at technical seminars held in China, Japan, Korea, Singapore and Taiwan.
"The significant participation in these seminars demonstrates how the combination of Teradyne’s products and industry-leading test expertise can provide customers with solutions that address the testing challenges of not only today, but the future as well”, said Randy Kramer, Manager, Teradyne's Factory Applications Engineering Organization.
Teradyne’s factory and field applications engineering teams developed and delivered presentations describing how to test the latest device interface ports including MIPI D-Phy, PCIe and DDR2/DDR3 memory bus interfaces as well as discussing strategic test topics such as concurrent testing, protocol aware fundamentals and 4G wireless applications. Teradyne said the seminars provided test engineers with an understanding of test techniques that provide improved test quality, faster time-to-market and lowest cost of test.
www.teradyne.com |
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