2009 International Printed Circuit and Electronics Assembly Fair Closes With Optimistic Outlook

Now in its eighth year, the 2009 International Printed Circuit and Electronics Assembly Fair (2009 HKPCA and IPC Show) reinforced its reputation as the flagship trade show for sourcing and technology exchange in Southern China for the PCB and EA industry. According to the organizers, the fair resulted in an encouraging turnout, with more than 30,000 visits recorded despite the difficulties faced by the industry. The fair was held at the Shenzhen Convention and Exhibition Center, China, from 2 to 4 December under the theme "Join Hands Leap Ahead”.

The emphasis of this year’s show, jointly organized by the Hong Kong Printed Circuit Association (HKPCA), the Association Connecting Electronics Industries (IPC) and the China Council for the Promotion of International Trade Guangzhou Sub-Council (CCPIT-GZ), was on building closer collaborative links throughout the supply chain to withstand the current market downturn and strengthen the industry in preparation for the expected economic recovery in 2010. According to on-site surveys, visitors found the show an excellent forum for exchanging ideas and information, seeking out new business partners, developing fresh opportunities, and bringing themselves up to date on the latest technology and product trends.

The show organizers said that visitors and exhibitors alike expressed optimism about the outlook for the industry next year, with general expectations of an upturn in demand. More than 350 exhibitors, including such major names as Atotech, C Sun, Dow (formerly Rohm and Haas), Elec & Eltek, Han’s, Hitachi Via, Jadason, Kingboard, Meadville, Multek, Schmoll, Techwise, Vega, WKK, World Wide and many more, made the show a sellout for the second consecutive year, with over 1,000 booths being rebooked for 2010 during the show days.

The recovering market, and particularly the growth of demand in China, will set a positive tone for the 2010 PCB and EA Fair, under the theme "Inspiration, Integration, Progression”. The fair, which will again be held at the Shenzhen Convention & Exhibition Center from 1 to 3 December 2010, will focus on the new growth opportunities opened up by market recovery following the consolidation period of the past year.

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