Nihon Superior to Highlight a Complete Suite of Soldering Materials at InterNepcon Japan 2010

Nihon Superior Co Ltd, a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its lead free solder at the upcoming InterNepcon Japan 2010, scheduled to take place January 20-22, 2010 at the Tokyo Big Site. This will include the company’s completely halogen free solder paste, SN100C P602 D4. Also, to showcase the versatility of SN100C, the company will display a range of production boards soldered with SN100C.

A highlight of this new range is the halogen free solder paste and flux cored wire that include no halogens, fluorine (F), chlorine (Cl), bromine (Br) or iodine (I) in their formulation, while still delivering excellent wetting on all substrates, the company said.

www.nihonsuperior.co.jp