Cobar Solder Products to Exhibit a Range of New Products at Pan Pac 2010

The Balver Zinn Group announces that Cobar Europe BV will exhibit a complete range of advanced soldering materials from bar solder to SMT solder paste to high-performance fluxes at the upcoming Pan Pacific Microelectronics Symposium and Tabletop Exhibition, scheduled to take place January 26-28, 2010 at the Sheraton Kauai Resort, on Kauai, Hawaii, USA.

In addition to new low VOC and VOC-free fluxes, stronger versions classified ORM-0 are available. The company will also introduce its new Aquasol Branded water soluble solder paste, which can be used with any commonly used soldering alloy.

Also on display, Balver Zinn will exhibit its SN100C plus some new innovative alloys and wire.

www.balverzinn.com
www.cobar.com