Momentive to Showcase New Electronics Materials at Material Japan 2010

Momentive Performance Materials will be exhibiting a range of new advanced materials for use in microelectronics applications at Material Japan 2010, taking place at Tokyo Big Sight on January 20, 2010. Experts from Momentive will feature a number of its latest technologies for the semiconductor, LED and flat panel display (FPD) industries, including the LA950S series high hardness and modulus adhesive, a variety of thermal interface materials, LED encapsulants and potting materials for FPDs.

"Momentive’s presence at Material Japan underscores our commitment to clients, as well as our continued investment in innovative technologies and new advanced products, backed by outstanding customer service,” said Satoru Okamoto, Japan Marketing Manager, Momentive Performance Materials. "These new breakthrough materials are a result of world-class research and development and rigorous production procedures, and we are excited to share them with electronics materials specialists and manufacturers at Material Japan.”

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