Nordson YESTECH Releases Batch Loading X-Ray Inspection Solution

Nordson YESTECH announced the introduction of its X1 semi-automatic, batch loading x-ray inspection system. According to the company, the new X1 provides users with a high resolution x-ray capability in a flexible, compact and maintenance free configuration, and is well-suited for inspecting mixed BGA/SMT devices, connectors and plated though hole (PTH) assemblies.

The X1 comes with Nordson YESTECH’s proprietary machine vision technology for fully automated inspection of BGA and flip chip devices. Other automated inspections include die attach, bond wire and correct assembly verification.

"X-ray inspection is an important tool for EMS providers in achieving high quality standards”, said Don Miller, Nordson YESTECH President. "Used for process/quality control and failure analysis, the X1 provides powerful inspection capability, accurate inspection results and a quick return on investment"

www.yestechinc.com