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Thursday, February 9, 2012
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PRINT EDITION > JANUARY 2010

REWORK & REPAIR: Array package rework system

1 January 2010

Metcal APR-5000 XL/XLS
• New software that allows the simultaneous use of inner and outer preheaters enabling fast and easy profiling
• Reduces rework cycle time and protecting the component under rework from thermal damage
• New design permits a lower nozzle temperature to achieve the same required temperature at the solder joints or balls while reducing BGA lid temperatures
• Rework wide range of PCBs and component types, from large boards up to 622 x 622mm to components down to 0.51 x 0.25mm
• Split Vision system with the highpowered magnification make placement and registration fast and accurate

OK International
www.okinternational.com

 
 
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