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Sunday, February 12, 2012
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PRINT EDITION > JANUARY 2010

SOLDERING EQUIPMENT: Dual lane reflow oven

1 January 2010

Dual Reflow
• Two reflow ovens in one, providing both high and low volume SMT soldering in one reflow unit
• Flexible production in parallel and is compatible for both lead free and leaded SMT
• 47 percent reduction in required floor space compared to traditional dual lane production lines
• Total of 18 independently programmable heating zones, with both top and bottom side heating areas
• Conveyor speeds and widths are both independently controlled and adjustable

SEHO Systems GmbH
www.seho.de

 
 
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