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ECD Adds New Training Classes to ECD-University
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| 22 February 2010 |
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ECD announced the addition of several new classes to its ECD-University program. According to the company, all its ECD-U classes provide training via an instructor-led live webcast, with question and answer time available. A manufacturer of thermal profiling equipment and software since 1964, ECD said it created ECD-U as a service to the industry, and has taught more than 2,000 students in the last several years. Classes are free, and require only an hour a day.
Entitled "Profiling A-Z” the first new class covers how to determine what points to profile (trouble spots, at-risk/"sensitive” components), thermocouple attachment methods (strategies for success, what to use when), and Thermal Quality Management’s (ThQM) core steps to profiling success (how to generate the oven recipe, how to document the results and build SPC data etc).
The second new class, "Verification 101” shows how reflow oven verification is a key, yet often missing, stage in any true and complete thermal quality management program. When used in its totality, a good thermal quality management program can reduce scrap and increase yield in the reflow solder process. It provides a guide to elicit the often missing dialogue between OEM and EMS and, together with a good system of oven verification, increases throughput and reduces liability by documenting adherence to the profile. Verification 101 will be presented on February 23 at 8:00 AM PST. Visit www.ecd.com/ecdu to find complete February class schedules and online registration information.
www.ecd.com
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