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Seica to Showcase Latest Test Systems at Nepcon Shanghai
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| 2 March 2010 |
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Seica SpA will be featuring their latest advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test, such as its flying prober Pilot VIP at Nepcon Shanghai, April 20th-22nd, 2010. The company has also teamed up with Temento Systems to develop the FlyScan module as a new approach to the integration of the boundary scan technique and flying probe test systems. Another product on show is PTE 100, an intelligent break-out box based on Seica’s standard VIP architecture.
www.seica.com
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