Rehm Thermal Systems Introduces Enhanced Reflow Cooling Technology

Rehm Thermal Systems has introduced new cooling zone designs for their Vision Series convection reflow ovens. According to the company, the new technology is particularly effective for the homogenous cooling of large thermal mass PCBs.

Depending upon the length of the system, the cooling area in the VisionXP is laid out in 2, 3 or 4 stages. The fans in the individual zones, which are available with separate speed/volume control, can cool even lead free processed PCBAs to below 50°C. The system also thereby provides precise cooling gradients that are critical to reduce thermal stress and resulting board twist and warp.

Rehm added that a highly effective new bottom side cooling configuration is now also available to assure even more homogenous cool-down. This design is particularly useful for uniformly processing thick PCBs, workpiece carriers, and PCBs with unevenly distributed inner copper layers, all of which present more thermally challenging processing.

"Lead free conversions and complex high thermal mass products stress traditional reflow processes,” commented John Bashe, Rehm General Manager. "Rehm has a successful history delivering the kind of advanced thermal solutions necessary to meet such challenges.”

www.rehm-group.com