Seica Develops Thermal Scan for its Line of Aerial Flying Probers

Seica Inc has just introduced "flying IC thermal detection units" on its line of Aerial flying probers. Two IC thermal detection units are positioned on each side of the unit under test to detect thermal parameters of ICs under power. The purpose is to compare temperatures of "known good” boards to "suspect” boards and indict bad components in the depot repair environment.

Seica said it is the first flying prober OEM to introduce this feature on its line of flying probers. Introducing thermal sensors with the traditional features already present on flying probers, such as in-circuit, functional, boundary scan and power up test make the flying prober a continuing evolving test tool to satisfy the demanding test needs of the production and depot repair markets, the company added.

In the market today, there are instances of large 'bone piles' of boards that require many hours of debug and testing by skilled senior technicians or engineers to return them to operational condition. Seica said the IC thermal detection unit capabilities allows for precise thermal measurement of the IC or other components while the part is powered up even under low voltage conditions. The simplicity of a thermal profile test can help reduce labor repair cost and improve inventory turnover, the company concluded.


Seica Inc is showing this new feature for the first time at IPC APEX Expo.

www.seica.com