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CyberOptics to Unveil Latest Inspection Equipment at APEX 2010
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| 23 March 2010 |
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CyberOptics Corporation announces that it will feature its latest inspection equipment at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort and Convention Center in Las Vegas, USA. The company will display the SE500 100 percent 3D solder paste inspection system at the show.
According to CyberOptics, this system has the ability to inspect the most demanding assemblies with a >80 cm2/second inspection speed without compromise to measurement accuracy and repeatability. The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 x 50mm up to 510 x 510mm. The SE500X can transport panels from 100 x 100mm up to 810 x 610mm.
The team at CyberOptics looks forward to welcoming visitors to its booth during the three-day event.
www.cyberoptics.com |
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