Leading Companies to Showcase New Products and Technologies at APEX 2010

Numerous companies in the electronics assembly and printed board industries will display their latest products and technologies at APEX 2010, scheduled to take place April 6-8, 2010 in Las Vegas, USA. These include:

Aqueous Technologies - The Zero-Ion g3 ionic contamination (cleanliness) tester automatically removes and detects contamination on an electrical assembly or bare board and provides quantitative contamination measurements.

Acculogic - FLS 980Dxi Flying Scorpion is a patented double-sided, multi-probe (16) flying probe system with 3D probing, analog, digital and boundary scan test capability on all probes (top and bottom side).

BTU International - Pyramax 100N convection reflow oven features 100 inches of heated length and eight zones, 350ºC maximum temperature, flexible platform configuration, low power and gas consumption, and a comprehensive menu of options.

CyberOptics - SE350 is the latest addition to CyberOptics’ 3D solder paste inspection system portfolio with its simple and robust design and calibration-free sensor technology.

Essemtec - Paraquda SMD pick-and-place machine features ultra short changeover times, a new intuitive operation system, Eplace, and an integrated quality management system.

Europlacer - The iineo SMT platform features many enhancements to the Europlacer machine range such as a higher feeder count, increased board size and increased maximum component height.

Everett Charles Technologies - ECT’s Contact Products Group will be on hand to demonstrate the company’s latest technologies and answer customer inquiries related to its range of products, which include bead probe technology, wire harness and battery probe.

EVS International - EVS 9000 solder recovery system offers a capacity of 20 kg/40 lb, and has the ability for single operation de-drossing of even the largest wave soldering machines.

Finetech - FINEPLACER Core offers rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 50 x 50mm BGAs, and handling PCBs up to 300 x 400mm.

Juki Corporation - With IPC speed of 60K cph, the FX-3XL modular placement machine expands Juki’s presence into the ultra-high speed assembly market with its optimization software and quick-change feeder banks.

Kyzen - An aqueous cleaning solution designed with a pH neutral formulation, AQUANOX A4703 is combined with Kyzen’s inhibition technology to provide superior material compatibility.

Microscan - Track, Trace and Control (TTC) Solution, developed in partnership with Cogiscan, features new Microscan TTC middleware, which can partner with any of its machine vision or auto ID hardware to address plant-wide information.

Milara - TD2929 is a fully automatic inline printer that offers dot dispensing capability for flexible solutions using Piezo dispensing technology and high speed operation at less than 5 seconds (excluding print).

Mirtec - Fully configured, the MV-7xi in-line AOI system provides one top down view 5 Mega Pixel camera, with a Precision 9.8 micron telecentric compound lens and four 5 Mega Pixel side-view cameras.

Nihon Superior - The company will display a range of production boards soldered with SN100C. A highlight of this new range is the halogen free solder paste and flux cored wire that include no halogens, fluorine (F), chlorine (Cl), bromine (Br) or iodine (I) in their formulation.

Production Solutions - RED-E-SET Ultra HD represents the next generation of high density board supports, designed for those applications requiring greater support during the printing and assembly process.

RMD Instruments - A new solder analysis and identification feature to its LeadTracer-RoHS XRF system accurately identifies all solder alloys within minutes and is helpful when completing rework or repair for finished assemblies.

SEHO Systems GmbH - GoSelective light offers high soldering quality and maximum flexibility particularly for small and medium-sized production volumes. If throughput requirements increase, the system can be upgraded with an additional coordinate fluxing unit and/or preheating module to reduce cycle times.

Valor Computerized Systems - The company will show a complete interoperable manufacturing execution suite designed to integrate solutions that will assist manufacturers in the design, planning, monitoring, control, scheduling, box build, traceability, test and rework processes.

VJ Technologies - Summit 1800 rework platform incorporates all of the innovative features that have been developed since the invention of high level, semi-automatic surface mount and microelectronics rework technology.

Source: MW Associates