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Everett Charles Technologies to Participate in APEX Test and Inspection Summit
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| 30 March 2010 |
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Everett Charles Technologies announces that Chad Hankinson, President of the Fixture and Services Group (FSG), will be a panellist on the Test and Inspection Summit at the upcoming IPC APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort and Convention Center in Las Vegas, USA. The summit will be held during Session FF01, which will take place Tuesday, April 6, 2010.
Building on the 2009 Summit, a panel of experts will discuss the latest test challenges and the technologies that are emerging to deal with them, including JTAG/boundary scan test and vectorless test techniques as well as the continued role of in-circuit electrical test, optical inspection, x-ray inspection and functional electrical test.
The emergence of 3D chips is posing test challenges to board and system designers as well as chip makers. Designers and manufacturers will have to pay particular attention to design-for-test techniques, leveraging the DFT that chip makers provide to support PCB test, field diagnostics, and field firmware upgrades.
Chad Hankinson has been in the loaded board test market with Everett Charles Technologies for the past 20 years and has been President of the Fixture and Services group for the past five years.
www.ectinfo.com |
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