GOEPEL Introduces New Features to Automate Hierarchical Test of Multi Chip Modules

GOEPEL electronic has introduced new features to specially support hierarchical tests of multi chip modules (MCM) as new extension of its software platform SYSTEM CASCON. According to the company, the enhanced tools provide a hitherto unrivalled automation level for the generation of module and board centric boundary scan tests based on hierarchical library models.

"In practice, multi chip modules play a highly important role to implement system-on-chip designs with integrated IEEE 1149.1 structures. Our new system features help to improve the efficiency of hierarchical test generation," says Thomas Wenzel, Managing Director of the Boundary Scan division of GOEPEL electronic GmbH. "The MCM models’ full independence from target board design ensures a complete portability of the entire package, and releases users from handling hierarchical CAD and boundary scan data.”

The core elements of the new solution are further developments of the graphical library section integrated in SYSTEM CASCON. Now it is possible to administrate IEEE 1149.1 multi chip modules as system-in-package (SiP). Thereby, SiP models may consist of a mix of boundary scan and non-boundary scan chips and dies, mounted in housings or stacked in a package-on-package (PoP) technology, the company added.

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