Vi Technology to Exhibit its Full Range of AOI Solutions to Reduce Defective PCBAs at Nepcon China 2010

Vi Technology announces that it will introduce the 2K High Speed compact AOI solution at Nepcon China 2010 in Shanghai from April 20 to 22, 2010. Designed to provide a solution to the most demanding applications, the AOI system combines very high throughput and extremely small components inspection to meet the challenges of miniaturization in high throughput SMT environments.

The company said it will also demonstrate its latest features to bring more value and efficiency in the production process, developed with the customer in mind. This includes the Vi-3D-SPC integrated SPC software, a full featured, easy to use SPC modular software platform. It is fully integrated with the 3D-SPI machine; data transfer is over a high speed network connection directly from the source. Also on show will be Vision2009, the new integrated software suite which encompasses full offline programming capability, an optimization tool, centralized common database, cross platform program transportability, review/repair station, and a data mining system.

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