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Indium Corporation's VP of Technology Recognized with Electronics Manufacturing Technology Award
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| 16 July 2010 |
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Indium Corporation's Vice President of Technology, Dr Ning-Cheng Lee, was recognized with the IEEE's Components, Packaging, and Manufacturing Technology Society (CPMT) Electronics Manufacturing Technology Award in acknowledgement of his contributions to electronics manufacturing technology. According to the CPMT, "Dr Lee has been a driving force in removing the 'art' of SMT assembly and replacing it with science. Ning-Cheng has identified and described numerous defect formation mechanisms, such as solder beading, slumping, swimming, solder robbing, voiding, head-in-pillow, and more. His elucidation of the fundamental elements of reactions occurring during the reflow process has corrected erroneous perceptions on reflow profiling held by the industry for over 20 years." The IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society is the international forum for scientists and engineers engaged in the research, design, and development of revolutionary advances in microsystems packaging and manufacture. They sponsor a variety of awards to recognize outstanding contributions and technical achievements in the electronics industry. Dr Lee is a renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. Dr Lee resides in Clinton, NY, USA.
www.indium.com
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