Kyzen to Feature Stencil Cleaning Solutions at Nepcon South China 2010

Kyzen will showcase its stencil cleaning solutions LONOX L5608 and LONOX L5611 at the upcoming Nepcon South China 2010 exhibition and conference. The event is scheduled to take place August 31-September 2, 2010 at the Shenzhen Convention and Exhibition Center.

LONOX L5608 is a low-COD aqueous cleaning solution designed to meet the challenges presented by the latest solder paste and flux formulations while meeting RoHS and environmental constraints. LONOX L5611 is an aqueous blend cleaning chemistry designed for optimum effectiveness on removing flux, solder paste and uncured adhesives from stencils and misprints.

LONOX L5608 and LONOX L5611 are RoHS compliant, halogen, halide and hexane free. According to Kyzen, these formulations have proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. Additionally, the Kyzen Applications Laboratory has evaluated all these formulations for effective removal of nearly 300 soldering materials from the world’s leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.

www.kyzen.com