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NEWS > AUGUST 2010

ATE China 2010 Set to Reenergize Growth of Electronics Assembly and Packaging Industry

10 August 2010

The Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010) will take place between August 31 and September 2 at the Shenzhen Convention and Exhibition Center. The expo will highlight various types of electronics assembly and packaging facilities, both locally and abroad. It also will offer technical solutions to assembly and production problems and allow buyers to identify new suppliers ― all of which will enhance competitiveness in the industry.

As one of the regions in electronics manufacturing that is experiencing the fastest growth, South China’s electronics assembly products and packaging technologies are widely used in fields such as consumer electronics, electronic household appliances, computers, LED, communication equipment, medical facilities, automotive electronics, etc. With the global economy regaining its vitality and enterprise orders increasing, more and more companies are recognizing the importance of the automatic assembly and packaging market. Meanwhile, higher labor costs and acute labor shortages are intensifying the appeal of new products and technologies that can substitute human labor in testing, packaging and assembly. Against the backdrop of lower labor costs, higher production efficiency and corporate strategy adjustment due to the financial crisis, ATE China 2010 will be instrumental in helping companies improve production and management efficiency.

The exhibition will showcase assembly facilities and materials, electro-pneumatic instruments, machine vision systems, electronic packaging facilities, antistatic products, and much more. Additionally, it will facilitate the introduction of the latest assembly products and technologies in the electronics manufacturing industry, and attract a number of leading enterprises from across the entire spectrum of electronics manufacturing. These will include Kilews, Federal, Dalsa, Tensun, Dongguan Sumida Automation, Shenzhen Fukucima Industrial, Shenzhen JIT Technology, and many more. Many exhibitors will use the show as a platform on which to unveil new products and technologies.
Machine vision (MV) will be the highlight of the exhibition. For the application of miniaturized electronics assembly, new components and increasing production complexity, MV technology has become key to securing quality and promoting efficiency in production lines. Many exhibitors in the MV industry, such as Konsta, ACH Technology, Daheng Image Vision, Fujinon, PENTAX FA, Schneider and TELI will launch new products and technologies at the show. Shanghai Botrong Electric also will debut its BOA Smart Camera, specially designed for the unfavorable environment of factory production lines. The camera offers vision solutions at different levels and satisfies application needs in all aspects: from robot positioning to complete assembly verification.

Also at the show, Janues520, a 3D automatic in-line SPI from Shanghai Fudie Technology, will demonstrate its fully independent intellectual properties. Its innovative, multi-directional, multi-frequency structural light, and its phase shift packaging solution based on GPU computing (with two new invention patents and software copyright) can cope with the difficulties of inspecting flexible printed circuits. Also, it can shadow block to provide users with the best solution to effectively and precisely inspect the solder paste on the surface of PCBs.

Additionally, Shenzhen Servo Dynamics will display the Dalsa IPD vision system. Its BOA series of cameras, the smallest smart cameras in the industry, with built-in software and multi-processing engines, are known for its high cost performance ratio and can perform the full range of inspection tasks: defect inspecting, positioning, measuring, verifying and identifying.

Xi'an S/A Video-Telecom Tech also will release its automatic smart tag printing quality inspection system that consists of a machine vision inspection system, a tag eliminating system, tag transmission, a motion control system and a position detection system.

Electro-pneumatic instruments and antistatic products will be on show at ATE China 2010 too. Federal will display its new KGN antistatic facilities and miniaturized electric cylinder; while Shenzhen Kilews and Tonghe Industry and Trading will exhibit its newest products. Among these will be the AC/DC electric screwdriver, the electronic torque tester and the automatic screw unscramble. Sumida will showcase its linear robots and desktop welding robots; Shenzhen Toco Electronics will showcase its Screw Feeder ST-621A, the first new screw feeder with reverse functions and adjustable tracks that never choke materials. The company also will display an ST-610A Automatic Jump Pipe Forming Machine with adjustable span and zero waste. Zhejiang Yiyuan Electronic Technology will present its antistatic series, including its antistatic rubber table pad, mat, clothes and shoes. Shenzhen Chengxin Jiamei Technology will debut its LED/PCB Humidity-Proof Cabinet, the MSD/SSD Antistatic Ultra-low Humidity Drying Cabinet, the PCBA Quick Dehumidifying Drying Cabinet and the SMT 40° Temperature and Humidity Control Cabinet.

Nepcon South China 2010, said to be the largest and longest standing electronics manufacturing event in South China, will be held in conjunction with ATE China 2010. Approximately 25,000 key suppliers and buyers in the industry are expected to come together for the two shows.

www.atexpochina.com

 
 
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