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Sunday, February 12, 2012
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PRINT EDITION > JULY 2010

ASSEMBLY TOOLS & EQUIPMENT: Cutting laser for depaneling

1 July 2010

MicroLine 1000 S LPKF
• Compact system for UV-laser cutting of assembled PCBs
• Flexible and suited for high manufacturing variance
• UV laser beam cuts right along delicate components or circuit paths without mechanical or thermal interference
• Toolless method makes any contour a possibility
• Changes to the cutting paths are made via programming the software

LPKF
www.lpkf.com

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