Vi Technology to Exhibit its Latest Semiconductor AOI Solution at Semicon Taiwan 2010

Vi Technology announces it will exhibit the REVEAL Imager Series automated optical inspection (AOI) system for the semiconductor camera modules manufacturing industry. According to the company, this solution drastically decreases assembly costs and improves the quality levels of image sensors and camera modules manufacturing assembly in back end of the line environments. This AOI provides automated inspection capabilities for foreign materials and process defects thereby selecting only the know-good-dies and exact positioning of the sensor to significantly improve the lens-attach process yields.

"The camera modules packaging industry is currently under very high cost pressure. Components–sensors and lenses-become more and more complex and expensive, and every additional yield point significantly decreases skyrocketing scrap costs. To sustain the high volume production of such high-end sensors, new ways of performing optical inspection become mandatory”, said Jean-Yves Gomez, CEO of Vi Technology.

"By combining high inspection accuracy for micron-level defect detection and high production throughput, Vi Technology's REVEAL Imager Series provide a flexible and breakthrough solution to this packaging processes. The first on-site trials have demonstrated the capability and the huge cost savings generated by this inspection process. With a return-on-investment that can be as fast as one to three months, there is no wonder this product has already received such a great welcome in the industry," he added.

The REVEAL Imager system is a turnkey solution allowing either a standalone or an integrated in-line use with customized handling equipment. It can therefore be adapted to any products type and size as well as any carriers’ kind such as stiffeners, PCBs or strips, Vi Technology added.

www.vitechnology.com