iNEMI Schedules Roadmap Workshop in Shanghai

The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, is planning a roadmap workshop in China, to be held in conjunction with the HDP’06 conference. The workshop, co-sponsored by HDP’06, SMIT and IEEE CPMT Society (Components, Packaging and Manufacturing Technology), is a half-day meeting, scheduled for Tuesday, June 27, from 3:30 to 7:30 p.m. on the Yan Chang Campus of Shanghai University.

According to iNEMI, the workshop will give attendees a preview of draft chapters of the 2007 iNEMI Roadmap, including highlights of select market segments and six of the nineteen technology and infrastructure areas covered by the roadmap (semiconductors, packaging, board assembly, environmental, organic substrates and sensors). The session will also allow discussion of, and input into, the draft chapters, helping to ensure inclusion of issues that are important to Asia-based companies.

“This is the first roadmap workshop that iNEMI has held in Asia,” said Dongkai Shangguan, senior director of advanced assembly and environmental technologies for Flextronics, and chair of the iNEMI Board Assembly Technology Working Group (TWG). “As iNEMI continues to broaden international participation in the roadmap, they are actively soliciting input through regional workshops, such as this one. Attendees will have the advantage of getting an advance preview of select chapters, and will also have the opportunity to interact and network with key technology and business leaders from the region.”

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