Host of Companies to Present During SMTA International 2010

A multitude of companies will be presenting papers at the upcoming SMTA International, scheduled to take place October 24-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida, USA.

VJ Technologies Inc announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled "PCB Pad Site Dress Methods on BGA and Socket Pad Arrays”. This study compares manual and semi-automated Printed Circuit Board (PCB) pad site dress methods. Each method is analyzed to understand which method can prevent board damage to the PCB pads such as pad lift, pad cratering and solder mask web damage on various Ball Grid Array (BGA) package types.

Kyzen announces that Rich Brooks will present a paper titled "Issues and Concerns in Cleaning Under Low Profile Components”. This paper will review the cleaning problems brought about with the implementation of the latest technologies and explain how the cleaning process can be optimized to guarantee the reliability of the assemblies. Dr Mike Bixenman along with co-author Steve Stach from Austin American Technology will present a paper titled "Validation of New ‘ROSE’ Test”. This paper reviews the limitations of the current test method and validates a new modified test method that greatly improves the ability to dissolve and detect trapped residues that could limit product performance.

Fred Dimock, Process Technology Manager at BTU International, will present a paper titled "Experiences in Transferring Recipes from an Eight Zone Reflow Oven to a Ten Zone Oven”. This practical presentation describes the methodology used to quickly transfer numerous recipes from an eight zone reflow oven to a ten zone oven for a high-mix contract manufacturer.

SEHO Systems GmbH announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled "Process Control – Basis for a Cost-Effective Selective Soldering Process”. This paper will give a comprehensive survey about the single process steps and the possibilities that exist to monitor and control them.

Nihon Superior Co Ltd announces that Keith Sweatman will present a paper titled "The Development of an Improved Tin-Zinc Solder”. In this paper, the authors report work to produce a solder that appears to have a real prospect of filling a well recognized gap in the application range of lead free solders.

Source: MW Associates