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SEHO Expands its Range of Nozzle Geometries for Wave Soldering Machines
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| 15 October 2010 |
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SEHO Systems GmbH has expanded its range of nozzle geometries for wave soldering machines.
According to the company, the growing diversity in power electronics poses special new challenges for wave soldering. The current focus is on sufficient heat input with high-throughput requirements. SEHO said its range of nozzle geometries provides for every application, from single solder nozzles to a combination of different nozzle geometries. The nozzles significantly reduce typical soldering defects such as insufficient fillings, open solder joints and soldering bridges.
The changing manufacturing requirements mainly manifest themselves in the configuration of the soldering area. Here, the classic combination of a narrow solder nozzle in the first position and a broader one on the second is being reversed. The result is longer wetting times and improved heat input. Depending on the product, the throughput of the wave soldering system can be accelerated by up to 40 percent, significantly increasing productivity in electronics manufacturing, added SEHO.
All SEHO solder nozzles are suitable for processing lead free solder alloys. The nozzles can be changed quickly via bayonet couplings in order to minimize retooling and maintenance times.
www.seho.de
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