EM Asia Innovation Awards 2006 SPECIAL

EM Asia Innovation Awards 2006 SPECIAL




The inaugural Electronics Manufacturing (EM) Asia Innovation Awards were held at NEPCON China on April 5, 2006 in Shanghai and received overwhelming response and support from the electronics manufacturing industry. The ceremony brought together more than 100 industry professionals who celebrated the companies that achieved excellence and the highest standards in the Asian electronics industry.

The purpose of the Awards is to honor top brands of various manufacturing related products, materials and equipment introduced and offered for sale between May 2005 and February 2006. Winners were chosen by a panel of independent judges comprising of professionals from leading associations, academia as well as industry users. They were judged according to innovation and outstanding achievement in product development.

“The Innovation Awards provide an effective platform to recognize excellence among key players in the electronics manufacturing industry within Asia. All our winners have made major contributions towards their respective fi elds and we congratulate them on their achievements.” said Catherine Wong, Publisher of EM Asia.

The 2007 awards will be held in Shanghai. More details will be released in September 2006. Below is the winners’ listing followed by a brief description of the products, materials and equipment submitted by the winners of each category:



Adhesive/Coating/Encapsulating Materials
Indium Corporation


Indium Corporation Features Triple - Award Winning NF260 No-Flow Underfill


Indium Corporation’s NF260 delivers increased reliability one order of magnitude over the leading competitor and two orders of magnitude over not using an underfi ll. It saves money by easily integrating with existing SMT processes and it can be processed in typical Pb-Free refl ow profi les. NF260 also promotes excellent wetting, low voiding, durability in thermal cycling, and provides the necessary strength to withstand the most rigorous drop tests. NF260 is the winner of awards on three continents: Global Technology Award (Europe), SMT Vision Award (USA), and EM Asia Innovation Award.
For more information about NF260 No-Flow Underfi ll, visit www.indium.com/nf260
or email askus@indium.com.

Assembly Line Tools
Juki Automation Systems


Juki Automation Systems - SCS


An innovative process management and quality control tool, Setup Control System (SCS) is a feeder barcode verifi cation package that confi rms operator accuracy and provides related value-added functions, thereby improving overall quality as well as consistency of performance. There are four modules available: Barcode Parts Verifi cation (standard), Off-Line Machine Setup (optional), Traceability (optional) and Inventory Management (standard). The tool provides improved accuracy and productivity, and reduces operator workload. Additionally it accurately tracks component usage and stock, as well as
identifi es boards with defective components.

Cleaning Equipment

Aqueous Technologies Corp. - Self-cleaning Wash Tank


The self-cleaning wash tank has been designed with no horizontal fl oor surfaces, preventing solder paste from building up on the tank’s fl oor. Additionally, it is equipped with multiple funnels mounted on the tank’s fl oor. The end of the funnels feeds into a small diameter metal tube. Water is pumped through the tube at the rate of 15 ft per second, briskly sweeping solder paste into a specially designed fi lter housing where the solder paste is captured. In addition to preventing solder paste from entering a waste stream, the self-cleaning wash tank completely eliminates any direct contact between an operator and hazardous solder paste.

Materials
Kyzen Corporation


Kyzen Corporation - AQUANOX A4630


AQUANOX A4630 was designed from the ground up to clean lead-free materials while providing the lowest cost of ownership technology in the industry. This 6thgeneration product brings ambient temperatures and low concentrations while exceeding industry standards for both people and environmental safety. A4630 is typically used in aqueous spray-in-air equipment at 10 to 20 percent, from ambient temperatures. The cleaner provides brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.




Contract Services
Wong Kong King Technology Ltd.


Wong Kong King Technology Ltd. - Services WKKT provides high-quality EMS relationships by establishing long-term customer partnerships, and by offering full-range manufacturing services from material sourcing and acquisition, to manufacturing, testing and inspection, and distribution with world-class quality. The company provides full range of comprehensive lifecycle manufacturing services to support the manufacturing of electronics, including to OEMs, ODMs, printed circuit board assemblers and systems assemblers. WKKT uses the latest in high technology placement and test equipment to provide the widest range of
electronics manufacturing capabilities.

Dispensing Systems/Equipment
DEK International


DEK International - ProFlow DirEKt Imaging


Since its introduction in 1997, ProFlow systems have been installed by DEK customers in all corners of the globe, representing around 80% of all enclosed printheads currently in action worldwide. In migrating from squeegees to enclosed printhead technology through the adoption of ProFlow® DirEKt Imaging technology, users have benefi ted from enhanced throughput, higher process yields, improved effi ciency, and lower material consumption.




Environmentally Friendly Products/Services
Kester Inc.


Kester Inc. - EnviroMark 907 Solder Paste


Kester’s EM907 No-Clean Lead-Free Solder Paste is specifically for the higher thermal demands of assembling with higher melting temperature lead-free alloys, such as the family of SnAgCu (SAC) alloys. Featuring a long stencil life, the solder paste offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste. EM907 is capable of extended downtimes in printing, and maintains excellent print quality at high print speeds. This product also has excellent cold and hot slump behavior, thus preventing bridges and solder ball formation.




Inspection Equipment – AOI

Test Research Inc. - TR7100EP


TR7100EP imagery tester is developed to target light, thin and high-density electrical products. Using optical imaging
testing, it can still guarantee the quality of products without use of fi xture or any electronic testing. TR7100EP will be the best-suited tester in the near future for 3C devices and other electronic products. Please refer to our website: www.tri.com.tw




Inspection Equipment – X-ray
Dage (SE Asia) Pte. Ltd.


Dage (SE Asia) Pte. Ltd. - XiDAT XD7600


Leading the x-ray inspection fi eld of competitors, Dage system has high image resolution, grayscale analysis and ease of operation. With a 1.3M pixels resolution (65,000 levels of grayscale) and 70 degrees oblique angle, XD7600 have signifi cant improvement over existing technology. Auto-wire sweep inspection, Ant-vibration AXIS, joystick and CT option function are available.





Pick and Place Equipment


Europlacer - 3DPS Adaptive Positioning System


The 3DPSTM is an innovative Adaptive Positioning System that picks up components with a turret head that is fitted with a contact sensor so the machine knows when it contacts a component or the board. Component pick up is compensated in X, Y and Z for each component type individually. Additionally, the 3DPSTM system automatically compensates for different picking altitudes as well as board bow and twist on placement.




Programming

BP Microsystems - Helix Integrated Programming System


The Helix programming system provides device-programming customers with the quality of automated device handling at a lower price. As a desktop automated system, the Helix comes standard with two precision designed tube input and output handling systems. Integrated in the handler are two BP Micro Enhanced 7th Generation programming sites with FX4TM socket module capability. The Helix system is designed to handle a range of packages and allows for an overall throughput of 800 devices per hour.


Repair/Rework Equipment

Finetech GmbH & Co KG - Fineplacer Pico SPR


The 01005 Small Passive Rework (SPR) Application Package for the FINEPLACER® Pico presents a solution for 01005 passive components. The system is equipped with high magnifi cation optics and an optical vision system, and the integrated dispensing unit applies solder paste to the landing pads of small passive components with small and stable volumes. The FINEPLACER® Pico SPR provides placement accuracy better than 5 μm and can meet future challenges.

Screen Printing Equipment
Speedline Technology Inc.


Printer with Enhanced Functionality


The MPM Accela printing system brings a revolutionary new design and theory of operation to the industry; creating a paradigm shift in the way electronics manufacturers view and measure printer performance. The Accela’s innovative parallel processing technology is refocusing the measurement of printer performance from base cycle time to total throughput – a much more important criteria for manufacturers requiring high volume throughput with high yield performance. Accela delivers ±12.5 microns at 6σ for alignment and ±25 microns at 6σ for printing performance (verified by an independent, third-party testing company).



Software

KIC - 24/7 Process Monitoring


KIC’s 24/7 Process Monitoring brings an innovative level of automation to the thermal process: Automatic profi ling of each
and every product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability – all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. The real-time process data enables engineers and managers to make crucial cost containment and quality control decisions, thereby improving overall quality and consistency of performance, as well as providing significant cost benefi ts to users.

Soldering Equipment
ESSEMTEC


Essemtec - RO300FC-N2 with RO-CONTROL Software


RO300FC is a full convection oven that allows fast and homogenous heating, as well as high-temperature soldering of sensitive electronics. The integrated convection technology features a vertical hot air stream that evenly heats the complete PCB. Both standard and lead-free pastes can be used. As an innovative new feature, RO300FC now features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for the process evaluation and process control for reflow ovens.




Soldering Materials
Henkel Corporation, Electronics Division


Henkel - Multicore® LF318 Solder Paste wins EM Asia Innovation Awards 2006


Developed to appeal electronics manufacturer who wish to qualify a single solder paste that offers reliable performance regardless of climactic condition, Multicore® LF318 is a lead-free, halide-free, pin-testable past formulation that delivers a broad process window for both printing and reflow.






Test Equipment
Keithley Instruments, Inc.


Keithley Instruments Model 2910 RF Vector Signal Generator


Model 2910 RF Vector Signal Generator delivers high-performance measurements for the lowest test equipment investment and cost of testing. The instrument has the industry’s best RF amplitude accuracy and modulation quality to improve test results and reduce false failures. Unique signal leveling results in less than 3 ms for switching between waveforms, remote frequency tuning, and amplitude settling.