Practical Components Adds Casio Micronics WLP Wafer Scale Technology to Lineup

Practical Components has added the Casio Micronics WLP Wafer Chip Size Package (WLP) to its comprehensive line of dummy components. The WLP is a miniature package, suitable for installation in surface mount technology (SMT).

WLP is a new technology for semiconductor devices that enables rerouting of the copper traces and encapsulation of the chips in epoxy resin while the wafer is intact. WLP can be differentiated from other IC packages by its unique production method that all the WLP packaging processes are carried out on a single silicon wafer. Aluminum pads are interconnected by Cu redistribution wirings to Cu posts. Epoxy resin is filled to protect the structure. Solder bumps (both eutectic and lead-free) are applied on the Cu posts. There is an increasing demand for electronics products that are more compact and offer a high level of performance, and WLP technology is ideal for applications such as mobile phones and digital cameras. Additionally, W-CSP has been adopted for new classes of devices such as power MOSFETs to enable their use in miniaturized equipment.

"The new Practical Components WLP dummy component will help users learn and assemble,” said Kevin Laphen, President of Practical Components. "We are excited to welcome Casio to the world class producers that make Practical Components the leader in dummy components.”

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